The purpose of this training is to train the participant theoretically but especially practical in the qualified placement and removal of various types of Ball Grid Arrays and Bottom Termination Components (BTC) on printed circuit board assemblies with various types of thermal masses.
This is done according to the relevant international IPC standards such as:
- IPC-7711-7721 Rework, Modification and Repair of Electronic assemblies
- ANSI/J-STD-001 Requirements for Soldered Electrical and Electronic assemblies
- IPC-7093 Design and Assembly Process Implementation for Bottom
- IPC-7095 Design and Assembly Process Implementation for BGAs
Dates and times
21.Mai 2024, in Heerlen, NL
Training structure
- IPC-7095 & 7093
- Qualified Rework & Repair of BGA/CSP/QFN
- X-ray inspection of BGA components
- BGA Reballing
- BGA Pad Repair and Modification
Attendees
This training is intended for participants who are directly or indirectly involved in the rework and repair of printed circuit boards assemblies on which Ball Grid Array components are mounted
Equipment
PIEK has an Expert 10.6 HV Rework stations in Heerlen.
Program
Program theory:
- Introduction Ball Grid Array
- BGA Rework
- QFN Rework
- CSP Rework
- BGA Reballing
- X-Ray inspection BGAs, BTCs, QFNs
Program practice:
- Making Reflow profiles (time temperature curve)
- BGA Rework
- QFN Rework CSP Rework
- Cleaning & Pad Preparation
- Reballing Ball Grid Array
- BGA Pad Repair and Modification
