lead-free ø 200-726 µm
Alloy: Sn96.5Ag3Cu0.5
Tolerance: ± 10 µm
Purity: 99,9%
Liquid: 217 °C
Packaging: Oxygen-free in Argon
Solder balls lead-free
Set variations | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Article Nr. | Description | Amount | Price | Remember | |||||||||||||||
 | VD90.5103 | Solder balls, 200µm (=3g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free CSP Article Nr.: VD90.5103 | |||||||||||||||||
| VD90.5104 | Solder balls, 250µm (=3g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free CSP Article Nr.: VD90.5104 | |||||||||||||||||
| VD90.5109 | Solder balls, 500µm (=24g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free CSP Article Nr.: VD90.5109 | |||||||||||||||||
| VD90.5106 | Solder balls, 600µm (=42g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free BGA Article Nr.: VD90.5106 | |||||||||||||||||
| HT00.1104 | Solder balls, 762µm (=18g), 10,000 pc Sn96.5Ag3Cu0.5, lead-free BGA Article Nr.: HT00.1104 | |||||||||||||||||
| VD90.5101 | Solder balls, 762µm (=86g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free BGA Article Nr.: VD90.5101 | |||||||||||||||||
