EXPERT 10.6 HV
Semiautomatic hybrid Rework station for repairing BGA, CSP and QFP components on medium-sized circuit boards.
Top FeaturesCamera-supported rework
EXPERT 10.6 HV
Rework Station with 3,300W hybrid under heater. The heating area of 275 x 245 mm² is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K). This system is particularly suitable for mid-size and large PCBs with fine-pitch components of varying package dimensions.
Product variations in the shop
 | DB00.1065 | EXPERT 10.6 HV Hybrid rework station, 3300W, autom. placement Article Nr.: DB00.1065 |
Standard equipment
- Tool set for dispensing, placing, residual solder removal and soldering with magazine
- Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
- Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
- Two camera lenses (BGA und CSP)
- Two thermocouple sensors (type K)
- Four PCB magnet holder 40,5 mm (standard)
- Two PCB clips to install at hand rest
- Foot switch
- Manual
- Intuitive software EASYSOLDER 07 with touch integration
Components
- BGA
- µBGA/CSP
- QFN
- DFN
- QFP
- PGA
- RF shields
- RF frames
- Rework on flex
- Small passives down to 0402
- SON
- Sockets
- LGA
- Package on Package (PoP)
- Connectors & Sockets
- CPU
- Underfilled or coated components
- Film capacitor
- LED rework
- Daughter boards
- Sub assemblies
- Interposer boards
Processes
- Desoldering
- Soldering
- Solder removal
- Dipping
- Paste printing
- Reballing
- Dispensing
Videos
The semi-automatic Rework station with hot gas facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.
The EXPERT 10.6 HV and HXV are perfect solutions for desoldering multiple components in one step. With this opportunity a tremendous amount of time can be saved.
Preparing the PCB surface for the soldering process with accurate residual solder removal using the combination of a hot-gas source with a vacuum pen.
Technical details
| Power consumption: | 3,500 VA | ||||||||||||||||||||||||||
| Power solder pen: | 300 W, 35 l/min | ||||||||||||||||||||||||||
| Power under-heating system: | 600-3,000 W | 6 x IR-lamps | |||||||||||||||||||||||||
| Size under-heating system: | 275 x 245 mm² | ||||||||||||||||||||||||||
| Max. PCB size: | 305 x 305 mm² | ||||||||||||||||||||||||||
| Resolution motion system: | 0,001 mm | ||||||||||||||||||||||||||
| Placement accuracy: | ± 0,015 mm | (Flip Chip)* | |||||||||||||||||||||||||
| ± 0,030 mm | (CSP) | ||||||||||||||||||||||||||
| ± 0,040 mm | (BGA) | ||||||||||||||||||||||||||
| ± 0,070 mm | (Maxi BGA)* | ||||||||||||||||||||||||||
| High resolution CMOS-camera: | 5 Mio. Pixel,USB2 | ||||||||||||||||||||||||||
| Size of component: |
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| Mains: | 1Phase, 230VAC, Fuse 16A | Connector Type CEE 32A (3 phase) | |||||||||||||||||||||||||
| Pressurized air: | 5-8 bar, 100 l/min | clean, dry air | |||||||||||||||||||||||||
| Dimensions: | 865 x 460 mm² | ||||||||||||||||||||||||||
| Weight: | 75 kg | ||||||||||||||||||||||||||
| * Optional extras |
Downloads
| Product flyer | 1.1 MB | Download |
Optional extras
 | SF64.0501 | Tool Slider 32mm for AVP 4.1 Article Nr.: SF64.0501 | |||||
 | SF64.0525 | Dip Tool 0.08mm with squeegee for tool shuttle 32 / 40mm Article Nr.: SF64.0525 | |||||
| SF64.0526 | Dip Tool 0.15mm with squeegee for tool shuttle 32 / 40mm Article Nr.: SF64.0526 | |||||
 | SF64.0527 | Dip Tool 0.22mm with squeegee for tool slider 32 / 40mm Article Nr.: SF64.0527 | |||||
 | SF64.0520 | Print Tool with squeegee for tool shuttle 32 / 40mm Article Nr.: SF64.0520 |
