Wessling, August 2015.
The trend towards increasingly small structures and integration of functionality in PCBs is challenging for dispensing systems.
News & PressLatest news about Martin.
Wessling, July 2015.
Reballing valuable BGA modules becomes increasingly important. For many years now, BGA modules are successfully reballed using the flexible MINIOVEN desktop devices by MARTIN. After reballing, they are soldered back onto the electronic ...
The Ideal Combination...
Wessling, March 2015.
Advanced and more complex electronic assemblies continue to present new technical challenges. At the 2015 SMT Hybrid Packaging exhibition in Nuremberg on 05 - 07 May, the Rework and Dispense innovator MARTIN GmbH will ...
Operator Convenience – First and Foremost (published in productronic 03/2013)
SMT assembly lines undergo continuous changes.
On the path to optimal assembly a lot of time and effort has been expended in recent years, especially in the realms of process feedback: only ...
Over recent years, a lot of investment has gone into improving processes to increase efficiency and quality. It is not surprising that this has also led to demands for greater reliability and repeatability in rework. MARTIN has recognized ...
Wessling, Mai 2012.
MARTIN GmbH has introduced a new Calibration Set to go with the EXPERT Series of rework stations. Five measurement and calibration adapters serve to establish and verify the most important performance criteria. Preparation for calibration ...
Wessling, April 2012.
IR Measurement Technology for the design and optimization of hot gas soldering tools results in greater process reliability and enables the most challenging tasks.
Wessling, November 2011. The newest challenge directed at the Engineers of Rework Specialists MARTIN in Wessling concerned components in the form: Package on Package (PoP), which are mostly used in mobile phones because of the limited space available. These packages often consist ...
Wessling, November 2011.
With combined soldering and pick up tooling for the MARTIN EXPERT series QFN components can be desoldered and safely lifted off the boards.
Wessling, November 2011. With increasingly large Printed Circuit Boards, especially in the communications sector, preheating during rework assumes a deciding role.
Wessling, November 2011. At the heart of every modern computer, the CPU is responsible for all the most important tasks. Even the smallest defect in the interconnection with the printed circuit board leads to malfunctions or missing significant functions. The use of sockets ...
Wessling, June 2011. LEDs are well on the way to becoming the most innovative components with the fastest growth rate.